Product Lines

Amphenol AITC

Amphenol is one of the largest manufacturers of interconnect products in the world. Within the Amphenol Corporate structure, the IT & Communications Product Group (AITC) is comprised of several key product divisions, including:

Amphenol GIS (

The Amphenol Global Interconnect Systems group designs, manufactures and delivers innovative high-quality interconnect solutions for broadband, industrial, IT & datacom, and mobile networks applications. With its global footprint and design and manufacturing facilities around the world, AGIS is capable of giving its customers the quality, speed and pricing they demand. BTAI represents the following AGIS divisions:

MegaChips (

MegaChips is a creator of innovative custom and ASSP semiconductor devices revolutionizing the image processing, gaming, audio, display, enterprise, home automation, and communications markets. They stand as a trusted and loyal partner to market leaders, delivering technology and expertise that enable products uniquely designed for people and engineered for performance.

Noreast Electronics (

Noreast Electronics designs and manufactures custom magnetic solutions, serving a wide range of industries. Specializing in mid range power applications from 400 Hz to 1MHz, with power applications of up to 10KVA, Noreast magnetic devices are often selected for critical applications, the military/aerospace market, and where harsh environment encapsulation design is required.

Trend Technologies (

With manufacturing locations around the world, Trend Technologies is a global supplier of metal and plastic products for virtually every industry. Trend has 30 years of world-class experience in precision metal fabrication, metal stamping, plastic injection molding, paint finishing, and electro-mechanical assembly.

WUS Printed Circuit Co., Ltd. (,

With four campuses totalling over 5.8 million square feet in China and Taiwan, and a headcount of over ten thousand, WUS Printed Circuit is one of the top twenty global PCB manufacturers in the world. WUS capabilities include backplanes up to 58 layers, high density line cards up to 34 layers, HDI up to 24 layers, hybrid PCBs, metal-backed PCB heat sinks, antennas, heavy copper process, and automotive products. WUS boasts a staff of over a hundred engineering staff to provide excellent front-end support and world-class quality control and environmental standards.